JEDEC JESD32
STANDARD FOR CHAIN DESCRIPTION FILE
standard by JEDEC Solid State Technology Association, 06/01/1996
NACE ASAE-ASABE B11 CGA ICC CTA
STANDARD FOR CHAIN DESCRIPTION FILE
standard by JEDEC Solid State Technology Association, 06/01/1996
N-CHANNEL MOSFET HOT CARRIER DATA ANALYSIS
standard by JEDEC Solid State Technology Association, 09/01/2001
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – NATURAL CONVECTION (STILL AIR)
standard by JEDEC Solid State Technology Association, 01/01/2007
DEFINITION OF THE SSTUB32869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
standard by JEDEC Solid State Technology Association, 01/01/2013
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS
standard by JEDEC Solid State Technology Association, 12/01/2011
LRDIMM DDR3 MEMORY BUFFER (MB)
standard by JEDEC Solid State Technology Association, 10/01/2014
FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 05/01/2004
TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 01/01/2008
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 03/01/2009
Joint JEDEC/ECA Standard: Definition of "Low-Halogen" for Electronic Products
standard by JEDEC Solid State Technology Association, 04/01/2015
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 08/01/2018