JEDEC JESD51-5
EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS
standard by JEDEC Solid State Technology Association, 02/01/1999
NACE ASAE-ASABE B11 CGA ICC CTA
EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS
standard by JEDEC Solid State Technology Association, 02/01/1999
TEST METHOD FOR BEAM ACCELERATED SOFT ERROR RATE
standard by JEDEC Solid State Technology Association, 11/01/2007
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 32-BIT LOGIC FUNCTIONS
standard by JEDEC Solid State Technology Association, 11/01/1999
DEFINITION OF SSTU32865 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
Addendum 1 to JESD96A – INTEROPERABILITY AND COMPLIANCE TECHNICAL REQUIREMENTS FOR JEDEC STANDARD JESD96A – RECOMMENDED PRACTICE FOR USE WITH IEEE 802.11N
Amendment by JEDEC Solid State Technology Association, 01/01/2007
APPLICATION SPECIFIC QUALIFICATION USING KNOWLEDGE BASED TEST METHODOLOGY
standard by JEDEC Solid State Technology Association, 10/01/2015
PSO-N/PQFN PINOUTS STANDARDIZED FOR 14-, 16-, 20-, AND 24-LEAD LOGIC FUNCTIONS
standard by JEDEC Solid State Technology Association, 03/01/2006
IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
standard by JEDEC Solid State Technology Association, 03/01/2009
PROCEDURE FOR CHARACTERIZING TIME-DEPENDENT DIELECTRIC BREAKDOWN OF ULTRA-THIN GATE DIELECTRICS
standard by JEDEC Solid State Technology Association, 08/01/2003