JEDEC JESD51-12
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
standard by JEDEC Solid State Technology Association, 05/01/2005
NACE ASAE-ASABE B11 CGA ICC CTA
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
standard by JEDEC Solid State Technology Association, 05/01/2005
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY ELECTRONIC PRODUCT SUPPLIERS
standard by JEDEC Solid State Technology Association,
A Guideline for Defining "Low-Halogen" Solid State Devices (Removal of BFR/CFR/PVC)
standard by JEDEC Solid State Technology Association, 11/01/2010
Low Power Double Data Rate 5 (LPDDR5)
standard by JEDEC Solid State Technology Association, 02/01/2019
POD135 – 1.35 V PSEUDO OPEN DRAIN I/O
standard by JEDEC Solid State Technology Association, 03/01/2018
LOW FREQUENCY POWER TRANSISTORS
standard by JEDEC Solid State Technology Association, 01/01/1976
GUIDELINES FOR SUPPLIER PERFORMANCE RATING
standard by JEDEC Solid State Technology Association, 01/01/2009
EMBEDDED MULTIMEDIACARD (e-MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL
standard by JEDEC Solid State Technology Association, 07/01/2009
Low Power Double Data Rate 3 SDRAM (LPDDR3)
standard by JEDEC Solid State Technology Association, 05/01/2012
THERMAL RESISTANCE TEST METHOD FOR SIGNAL AND REGULATOR DIODES (FORWARD VOLTAGE, SWITCHING METHOD)
standard by JEDEC Solid State Technology Association, 07/01/1986
GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING
standard by JEDEC Solid State Technology Association, 11/01/1996
DEFINITION OF THE SSTUB32869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007