JEDEC JESD22-B115A.01
SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 07/01/2016
NACE ASAE-ASABE B11 CGA ICC CTA
SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 07/01/2016
DEFINITION OF THE SSTE32882 REGISTERING CLOCK DRIVER WITH PARITY AND QUAD CHIP SELECTS FOR DDR3/DDR3L/DDR3U RDIMM 1.5 V/1.35 V/1.25 V APPLICATIONS
standard by JEDEC Solid State Technology Association, 12/01/2010
DEFINITION OF THE SSTUA32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY TEST FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
POD10 – 1.0 V Pseudo Open Drain Interface
standard by JEDEC Solid State Technology Association, 09/01/2011
MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, HIGH CAPACITY (MMCA, 4.2)
standard by JEDEC Solid State Technology Association, 07/01/2007
Low Power Double Data Rate 4 (LPDDR4)
standard by JEDEC Solid State Technology Association, 02/01/2017
BOND WIRE MODELING STANDARD
standard by JEDEC Solid State Technology Association, 06/01/1997
CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 10/01/2007
Solid-State Drive (SSD) Endurance Workloads
standard by JEDEC Solid State Technology Association, 07/01/2012
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
standard by JEDEC Solid State Technology Association, 03/01/2014
STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICES WITH 3.6 V CMOS TOLERANT INPUTS AND OUTPUTS
standard by JEDEC Solid State Technology Association, 10/01/2000