JEDEC JESD237
Reliability Qualification of Power Amplifier Modules
standard by JEDEC Solid State Technology Association, 03/01/2014
NACE ASAE-ASABE B11 CGA ICC CTA
Reliability Qualification of Power Amplifier Modules
standard by JEDEC Solid State Technology Association, 03/01/2014
HIgh Bandwidth Memory DRAM (HBM1, HBM2)
standard by JEDEC Solid State Technology Association, 11/01/2018
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
standard by JEDEC Solid State Technology Association, 01/01/2007
INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD – ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
standard by JEDEC Solid State Technology Association, 12/01/1995
VOLTAGE REGULATOR DIODE NOISE VOLTAGE MEASUREMENT
standard by JEDEC Solid State Technology Association, 05/01/1965
Serial Interface for Data Converters
standard by JEDEC Solid State Technology Association, 01/01/2012
PROCESS FAILURE MODE AND EFFECTS ANALYSIS (FMEA)
standard by JEDEC Solid State Technology Association, 05/01/2005
HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES
standard by JEDEC Solid State Technology Association, 02/01/1999
ADDENDUM No. 8 to JESD8 – STUB SERIES TERMINATED LOGIC FOR 3.3 VOLTS (SSTL_3) A 3.3 V VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 08/01/1996
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
standard by JEDEC Solid State Technology Association, 06/01/2013
BALL GRID ARRAY PINOUT FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS
standard by JEDEC Solid State Technology Association, 03/01/2004
COMPONENT QUALITY PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREMENTS (INCLUDING ADMINISTRATIVE QUALITY PROBLEMS)
standard by JEDEC Solid State Technology Association, 12/01/1999