JEDEC JESD8-6
ADDENDUM No. 6 to JESD8 – HIGH SPEED TRANSCEIVER LOGIC (HSTL)- A 1.5 V OUTPUT BUFFER SUPPLY VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 08/01/1995
NACE ASAE-ASABE B11 CGA ICC CTA
ADDENDUM No. 6 to JESD8 – HIGH SPEED TRANSCEIVER LOGIC (HSTL)- A 1.5 V OUTPUT BUFFER SUPPLY VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 08/01/1995
ADDENDUM No. 5 to JESD8 – 2.5 V 0.2 V (NORMAL RANGE), AND 1.8 V TO 2.7 V (WIDE RANGE) POWER SUPPLY VOLTAGE AND INTERFACE STANDARD FOR NONTERMINATED DIGITAL INTEGRATED CIRCUIT
standard by JEDEC Solid State Technology Association, 09/01/2007
STANDARD MANUFACTURERS IDENTIFICATION CODE
standard by JEDEC Solid State Technology Association, 04/01/2009
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGE
standard by JEDEC Solid State Technology Association, 10/01/2001
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 11/01/2010
METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
standard by JEDEC Solid State Technology Association, 04/01/1987
RECOMMENDED STANDARD FOR THYRISTORS
standard by JEDEC Solid State Technology Association, 06/01/1972
DEFINITION OF THE SSTUA32S865 AND SSTUA32D865 28-BIT 1:2 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
Low Power Double Data Rate 3 SDRAM (LPDDR3)
standard by JEDEC Solid State Technology Association, 08/01/2013
AIR-CONVECTION-COOLED, LIFE TEST ENVIRONMENT FOR LEAD-MOUNTED SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 03/01/1966
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 09/01/2012