JEDEC JESD78E
IC LATCH-UP TEST
standard by JEDEC Solid State Technology Association, 04/01/2016
NACE ASAE-ASABE B11 CGA ICC CTA
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS
standard by JEDEC Solid State Technology Association, 05/01/2002
Notification Standard for Product Discontinuance
standard by JEDEC Solid State Technology Association, 11/01/2014
RECOMMENDED PRACTICE FOR MEASUREMENT OF TRANSISTOR LEAD TEMPERATURE
standard by JEDEC Solid State Technology Association, 06/01/2004
HIGH BANDWIDTH MEMORY (HBM) DRAM
standard by JEDEC Solid State Technology Association, 10/01/2013
Mechanical Shock – Device and Subassembly
standard by JEDEC Solid State Technology Association, 06/01/2019
GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS
standard by JEDEC Solid State Technology Association, 09/01/1998
SUBASSEMBLY MECHANICAL SHOCK
standard by JEDEC Solid State Technology Association, 11/01/2004
SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT
standard by JEDEC Solid State Technology Association, 11/01/2008
GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATION
standard by JEDEC Solid State Technology Association, 10/01/2007
EMBEDDED MULTIMEDIACARD (e*MMC) PRODUCT STANDARD, STANDARD CAPACITY
standard by JEDEC Solid State Technology Association, 07/01/2007
TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 11/01/2010