JEDEC JESD241
Procedure for Wafer-Level DC Characterization of Bias Temperature Instabilities
standard by JEDEC Solid State Technology Association, 12/01/2015
NACE ASAE-ASABE B11 CGA ICC CTA
Procedure for Wafer-Level DC Characterization of Bias Temperature Instabilities
standard by JEDEC Solid State Technology Association, 12/01/2015
THERMAL SHOCK
standard by JEDEC Solid State Technology Association, 11/01/2016
DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS
standard by JEDEC Solid State Technology Association, 07/01/2000
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/2005
HSUL_12 LPDDR2 I/O
standard by JEDEC Solid State Technology Association, 08/01/2009
DDR2 SPD INTERPRETATION OF TEMPERATURE RANGE AND (SELF-) REFRESH OPERATION
standard by JEDEC Solid State Technology Association, 06/01/2006
QUALITY SYSTEM ASSESSMENT
standard by JEDEC Solid State Technology Association, 10/01/2013
STANDARD DESCRIPTION OF LOW-VOLTAGE TTL-COMPATIBLE, 5 V TOLERANT CMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 06/01/1996
SERIAL FLASH RESET SIGNALING PROTOCOL
standard by JEDEC Solid State Technology Association, 10/01/2018
MEASUREMENT OF SMALL-SIGNAL TRANSISTOR SCATTERING PARAMETERS
standard by JEDEC Solid State Technology Association, 11/01/1972
SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES
standard by JEDEC Solid State Technology Association,