JEDEC JESD22-B106E
RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
standard by JEDEC Solid State Technology Association, 11/01/2016
JEDEC JEP130A
GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING
standard by JEDEC Solid State Technology Association, 02/01/2006
JEDEC JESD51-8
INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – JUNCTION-TO-BOARD
standard by JEDEC Solid State Technology Association, 10/01/1999
JEDEC JESD22-A106B
THERMAL SHOCK
standard by JEDEC Solid State Technology Association, 06/01/2004
JEDEC JEP122H
Failure Mechanisms and Models for Semiconductor Devices
standard by JEDEC Solid State Technology Association, 09/01/2016
JEDEC JESD218B.01
SOLID STATE DRIVE (SSD) REQUIREMENTS AND ENDURANCE TEST METHOD
standard by JEDEC Solid State Technology Association, 06/01/2016
JEDEC JESD8-21A
POD135 – 1.35 V PSEUDO OPEN DRAIN I/O
standard by JEDEC Solid State Technology Association, 09/01/2013
JEDEC JESD209-4-1
Addendum No. 1 to JESD209-4 – Low Power Double Data Rate 4 (LPDDR4)
Amendment by JEDEC Solid State Technology Association, 01/01/2017
JEDEC JEP147
PROCEDURE FOR MEASURING INPUT CAPACITANCE USING A VECTOR NETWORK ANALYZER (VNA)
standard by JEDEC Solid State Technology Association, 10/01/2003
JEDEC JESD 22-A118 (R2008)
ACCELERATED MOISTURE RESISTANCE – UNBIASED HAST
standard by JEDEC Solid State Technology Association, 12/01/2000
JEDEC JEP174
UNDERSTANDING ELECTRICAL OVERSTRESS – EOS
standard by JEDEC Solid State Technology Association, 09/01/2016
JEDEC JESD72A
TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS
standard by JEDEC Solid State Technology Association, 03/01/2018