JEDEC JEP139
GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 12/01/2000
NACE ASAE-ASABE B11 CGA ICC CTA
GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 12/01/2000
Universal Flash Storage (UFS) Unified Memory Extention
standard by JEDEC Solid State Technology Association, 03/01/2016
JC-42.6 MANUFACTURER IDENTIFICATION (ID) CODE FOR LOW POWER MEMORIES
standard by JEDEC Solid State Technology Association, 03/01/2014
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS
standard by JEDEC Solid State Technology Association, 10/01/2006
COMMON FLASH INTERFACE (CFI)
standard by JEDEC Solid State Technology Association, 09/01/2003
STANDARD FOR DESCRIPTION OF 54/74ACXXXXX AND 54/74ACTXXXXX ADVANCED HIGH-SPEED CMOS DEVICES
standard by JEDEC Solid State Technology Association, 09/01/1990
STANDARD FOR SELENIUM SURGE SUPPRESSORS
standard by JEDEC Solid State Technology Association, 11/01/1973
STANDARD FOR DESCRIPTION OF 3867 – 2.5 V, SINGLE 10-BIT, 2-PORT, DDR FET SWITCH
standard by JEDEC Solid State Technology Association, 11/01/2001
FULLY BUFFERED DIMM DESIGN FOR TEST, DESIGN FOR VALIDATION (DFx)
standard by JEDEC Solid State Technology Association, 07/01/2008
STANDARD DESCRIPTION OF 1.5 V CMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 08/01/2001
BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
standard by JEDEC Solid State Technology Association, 06/01/2002
PRODUCT DISCONTINUANCE
standard by JEDEC Solid State Technology Association, 05/01/2005