IPC TR-481
Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981
NACE ASAE-ASABE B11 CGA ICC CTA
Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981
The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993
IPC Phase 3 Controlled Atmosphere Soldering Study
standard by Association Connecting Electronics Industries, 08/01/1994