IPC JEDEC-9704A
Printed Circuit Assembly Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 02/01/2012
IPC SM-780
Component Packaging and Interconnecting with Emphasis on Surface Mounting
standard by Association Connecting Electronics Industries, 03/01/1988
IPC J-STD-030A
Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014
IPC J-STD-033B
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 10/01/2005
IPC TMRC-00T
2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC TR-464
Accelerated Aging for Solderability Evaluations
standard by Association Connecting Electronics Industries, 12/01/1987
IPC TP-104-K
Cleaning & Cleanliness Test Program, Phase 3, Water Soluble Fluxes Parts 1 and 2
Report / Survey by Association Connecting Electronics Industries, 10/01/1992
IPC J-STD-033D
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
standard by Association Connecting Electronics Industries, 03/01/2018
IPC WP-006
Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
standard by Association Connecting Electronics Industries, 07/01/2003
IPC LDFR0603
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC ML-960
Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/1994