IPC JP002
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006
IPC TR-483
Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991
IPC MB-380
Guidelines for Molded Interconnection Devices
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/1990
IPC TR-486
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001
IPC SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
standard by Association Connecting Electronics Industries, 11/01/1992
IPC J-STD-609A
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes
standard by Association Connecting Electronics Industries, 03/01/2010
IPC TMRC99T
TMRC Technology Trends for Rigid Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 06/27/2000
IPC J-STD-002B
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003
IPC J-STD-030
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005
IPC J-STD-003A
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2003
IPC WP-114
Guidance for the Development and Implementation of a White Plague Control Plan (WPCP)
standard by Association Connecting Electronics Industries, 12/01/2015