IPC WP-019A
White Paper on Global Change in Ionic Cleanliness Requirements
standard by Association Connecting Electronics Industries, 10/03/2018
IPC TR-468
Factors Affecting Insulation Resistance Performance of Printed Boards
standard by Association Connecting Electronics Industries, 03/01/1979
IPC J-STD-004
Requirements for Soldering Fluxes
standard by Association Connecting Electronics Industries,
IPC QE-605A
Printed Board Quality Evaluation Handbook
standard by Association Connecting Electronics Industries, 02/01/1999
IPC J-STD-002D
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 06/01/2013
IPC J-STD-012
Implementation of Flip Chip and Chip Scale Technology
standard by Association Connecting Electronics Industries, 01/01/1996
IPC TR-584A
IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")
standard by Association Connecting Electronics Industries, 08/01/2007
IPC TR-462
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
standard by Association Connecting Electronics Industries, 10/01/1987
IPC QF-143
Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
standard by Association Connecting Electronics Industries, 02/01/1992
IPC J-STD-033
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 04/01/1999
IPC L-108B
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 06/01/1990
IPC TMRC99R
TMRC 1999 Market for Flexible Circuits – TMRC99F
Report / Survey by Association Connecting Electronics Industries, 01/01/1999