IPC J-STD-005A
Requirements for Soldering Pastes
standard by Association Connecting Electronics Industries, 02/01/2012
NACE ASAE-ASABE B11 CGA ICC CTA
Requirements for Soldering Pastes
standard by Association Connecting Electronics Industries, 02/01/2012
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 03/01/2007
Standard for Visual Optical Inspection Aids
standard by Association Connecting Electronics Industries, 10/01/1993
Post Solder Solvent Cleaning Handbook
standard by Association Connecting Electronics Industries, 08/01/1999
Troubleshooting Guide for Printed Board Manufacture and Assembly
standard by Association Connecting Electronics Industries, 12/01/1997
Qualifications and Performance of Polymer Thick Film Printed Boards
standard by Association Connecting Electronics Industries, 01/01/1987
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003
Supporting Data and Numerical Examples for ANSI./J-STD-001B: Appendix D (Control of Fluxes)
standard by Association Connecting Electronics Industries, 11/01/1996
Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
standard by Association Connecting Electronics Industries, 06/01/2002
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 07/01/2002