IPC 9708
Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010
NACE ASAE-ASABE B11 CGA ICC CTA
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987
Component Identification Training and Reference Guide
standard by Association Connecting Electronics Industries, 03/01/2011
Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Printed Circuits
standard by Association Connecting Electronics Industries, 12/10/1997
HDIS 1998 Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1998
Component Identification for Through Hole and Surface Mount
Training Material by Association Connecting Electronics Industries, 07/01/2002