IPC 4101C

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009

IPC A-142

Specification for Finished Fabric Woven from Aramid for Printed Boards
standard by Association Connecting Electronics Industries, 06/01/1990

IPC 2513A

Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description
standard by Association Connecting Electronics Industries, 11/01/2000

IPC HDBK-005

Guide to Solder Paste Assessment
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2006

IPC A-610F-WAM1

Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016

IPC 4103A-WAM1

Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014

IPC J-STD-001FS WAM1

Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 2017

IPC 2512A

Sectional Requirements for Implementation of Administrative Methods for Mfg. Data Description
standard by Association Connecting Electronics Industries, 11/01/2000

IPC 2581B

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 09/01/2013

IPC 9199

Statistical Process Control (SPC) Quality Rating
standard by Association Connecting Electronics Industries, 09/01/2002

IPC A-600K

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/09/2020

IPC HM-860

Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987