IPC 1601

Printed Board Handling and Storage Guidelines
standard by Association Connecting Electronics Industries, 08/01/2010

IPC 2221A

Generic Standard on Printed Board Design
standard by Association Connecting Electronics Industries, 05/01/2003

IPC FC-232C

Specification for Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring
standard by Association Connecting Electronics Industries, 08/01/1992

IPC 6018CS

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Amendment by Association Connecting Electronics Industries, 07/01/2016

IPC 2225

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998

IPC 9850A

Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 11/01/2011

IPC 7621

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018

IPC 4101C

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009

IPC 4101A

Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
standard by Association Connecting Electronics Industries, 06/01/2002

IPC 1131

Information Technology Guide for PWB Manufacturers
Handbook / Manual / Guide by Association Connecting Electronics Industries, 04/01/2000

IPC 3408

General Requirements for Anisotropically Conductive Adhesives Films
standard by Association Connecting Electronics Industries, 11/01/1996

IPC DD-135

Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
standard by Association Connecting Electronics Industries, 08/01/1995