IPC 2226A

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

IPC D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989

IPC 4101E

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2015

IPC A-38

Fine Line Round Robin Test Pattern
standard by Association Connecting Electronics Industries, 09/01/1984

IPC CA-821

General Requirements for Thermally Conductive Adhesives
standard by Association Connecting Electronics Industries, 01/01/1995

IPC 4203A

Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 01/01/2013

IPC 9501

PWB Assembly Process Simulation for Evaluation of Electronic Components
standard by Association Connecting Electronics Industries, 07/10/1995

IPC 9691B

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016

IPC 9204

Guideline on Flexibility and Stretchability Testing for Printed Electronics
standard by Association Connecting Electronics Industries, 02/01/2017

IPC A-620

Requirements & Acceptance for Cable & Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 01/01/2002

IPC 4554 Amendment 1

Amendment 1 to Specification for Immersion Tin Plating for Printed Circuit Boards
Amendment by Association Connecting Electronics Industries, 08/01/2012

IPC 4101D

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2014