IPC 4554-WAM1

Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2012

IPC J-STD-001F-WAM1

Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 04/01/2016

IPC 1401

Supply Chain Social Responsibility Management System Guidance
standard by Association Connecting Electronics Industries, 03/01/2017

IPC 4101

Specifications for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 12/10/1997

IPC 1791

Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 08/01/2018

IPC 0040

Optoelectronics Assembly and Packaging Technology
standard by Association Connecting Electronics Industries, 05/01/2003

IPC 2223D

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016

IPC 9709

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
standard by Association Connecting Electronics Industries, 11/01/2013

IPC 2316

Design Guide for Embedded Passive Device Printed Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 03/01/2007

IPC 4553

Specification for Immersion Silver Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 06/01/2005

IPC 4204

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002