IPC A-610GC-Telecom(D)1

Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2019

IPC 4203

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002

IPC 6018B

Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 11/01/2011

IPC 6012ES

Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 2020

IPC 7711/7721C

Rework, Modification and Repair of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2017

IPC 1751A

Generic Requirements for Declaration Process Management
standard by Association Connecting Electronics Industries, 02/01/2010

IPC HERMES-9852

The Global Standard for Machine-to-Machine Communication in SMT Assembly
standard by Association Connecting Electronics Industries, 06/01/2019

IPC 6011

Generic Performance Specification for Printed Boards
standard by Association Connecting Electronics Industries, 07/01/1996

IPC 7711/7721B

Rework, Modification and Repair of Electronic Assemblies
standard by Association Connecting Electronics Industries, 11/01/2007

IPC 4554-WAM1

Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2012

IPC DW-424

General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995