IPC 7530
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
standard by Association Connecting Electronics Industries, 06/01/2001
IPC A-610C
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2000
IPC 1791- Amendment 1
Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2019
IPC 4411-AM1
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001
IPC 4101E-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2020
IPC J-STD-001C S-Addendum
Space Applications Electronic Hardware Addendum to Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2004