IPC 4556

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013

IPC 2223B

Sectional Design Standard for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2008

IPC 6015

Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
standard by Association Connecting Electronics Industries, 02/01/1998

IPC 7093

Design and Assembly Process Implementation for Bottom Termination Components
standard by Association Connecting Electronics Industries, 03/28/2011

IPC 4552A

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2017

IPC 6012D-AM1

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 09/01/2017

IPC D-640

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring
standard by Association Connecting Electronics Industries, 06/01/2016

IPC 4921A

Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 05/01/2017

IPC 4204A

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/31/2012

IPC 4921

Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 06/01/2012

IPC 2524

PWB Fabrication Data Quality Rating System
standard by Association Connecting Electronics Industries, 02/01/1999

IPC A-23

Polymer Thick Film Artwork
standard by Association Connecting Electronics Industries,